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CASSETTE TO CASSETTE SYSTEMS FOR HVM

Platforms may be clustered to combine technologies and processes with either cassette or single wafer loading options for production capable high volume device manufacturing across many technologies. Hexagonal or square transfer chamber configurations are available.

PlasmaPro 100 PECVD

PlasmaPro 100 PECVD

Specifically designed to produce excellent uniformity and high rate films with a wide temperature range electrode. Compatible with wafers up to 200mm.

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PlasmaPro 100 Estrelas

PlasmaPro 100 Estrelas DSiE Deep Si Etch

Designed to give total flexibility for Deep Silicon Etch (DSiE) across a wide range of applications. Estrelas offers smooth sidewall and high aspect ratio processes.

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Atomfab ALD

Atomfab ALD

Fast, low damage, low CoO production plasma ALD processing for GaN power and RF devices. Atomfab is the fastest remote plasma production ALD system on the market.

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Ionfab 300

Ionfab 300 IBE IBD

Ion beam deposition and etching system with unmatched batch uniformity and the capability to be clustered with other plasma etch and deposition systems.

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PlasmaPro 100 Cobra

PlasmaPro 100 Cobra

High-density plasma for fast etching and deposition rates. The process modules offer excellent uniformity, high-throughput, high-precision and low-damage processes for wafer sizes up to 200mm.

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PlasmaPro 100 RIE

PlasmaPro 100 RIE

Delivering anisotropic dry etching for an extensive range of processes. Compatible with all wafer sizes up to 200mm with rapid change between wafers and low cost of ownership.

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PlasmaPro 100 Polaris

PlasmaPro 100 Polaris ICP Etch

An evolution in single wafer etch technology. Polaris offers a smart ICP etching solution for harsh chemistries yields excellent uniformity.

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