Silicon Nitride

Silicon Nitride(SiNx) is widely used in the semiconductor industry. It's applications include device passivation and etch masks. Si₃N₄can be deposited using the following techniques:

Silicon Nitride Si3N4

Good uniformity and profile with low damage.

Wafer size:up tp 200mm
- Product:PlasmaPro 100 Cobra

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Anisotropic and isotropic profile available at competitive etching rate with optimised uniformity.

Wafer size:up to 100mm
- Product:PlasmaPro 80
Wafer size:up to 200mm
- Product:PlasmaPro 800

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Competitive etching rate, selectivity and profile.

Wafer size:up to 200mm
- Product:Ionfab 300

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Silicon nitride is known to be a challenging material for ALD. Our systems allow for high material quality and low damage deposition, even at low deposition temperature. ALD silicon nitride can be used for moisture barrier applications and as a spacer in advanced transistors.

High material quality and low damage, even at low deposition temperature.

Wafer size:up to 200mm
- Product:FlexAL

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Different chemistries can be used: pure and diluted silane
High quality films with low BOE
Excellent film thickness uniformity
Low hydrogen content with NH₃free process
Film stress control
Refractive index control
Low temperature deposition down to 20°C
Deposition rates from 5-100nm/min

Wafer size:up to 200mm
Batch size:up to 9x2" 4x3"
- Product:PlasmaPro 80&PlasmaPro100

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Different chemistries can be used: pure and diluted silane
High quality films with low BOE
Excellent film thickness uniformity
Low hydrogen content with NH₃free process
Film stress control
Refractive index control
Deposition rates from 5-500nm/min

Wafer size:up to 200mm
- Product:PlasmaPro 100
Wafer size:up to 300mm
- Product:PlasmaPro 800

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Excellent stoichiometry with competitive deposition rate and controlled stress.

Wafer size:up to 200mm
- Product:Ionfab 300

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