International Symposium for Testing and Failure Analysis
ISTFA 2018
Oct
28

ISTFA 2018

Meet Oxford Instruments at ISTFA 2018

We're looking forward to meeting you at the event and discussing your current work and workflows with you. If you would like to book a meeting with us at the show, please complete the form below.

Oxford Instruments provide industry-leading processes and tools for Failure Analysis (FA) dry etching de-processing, including:

  • Polyimide removal (RIEorICPmode)
  • Isotropic Nitride (passivation) removal (PEorICPmode)
  • Anisotropic Oxide (IMD/ILD) removal (RIEorICPmode)
  • Anisotropic Low-K Oxide removal (RIEorICPmode)
  • Metal skeleton removal (RIEorICPmode)

Our Failure Analysis tools allow a wide range of processes, able to process small die or packaged devices through to 300mm wafers.

Location

Phoenix, Arizona

Booth Number: #320

Date

28thOct - 1stNov

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Plasma Technology, NanoAnalysis

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